Microelectronic Failure Analysis Desk Reference: 2001 Supplement

CD-ROM content is in fully searchable Adobe Acrobat PDF format, Developed by the Electronic Device Failure Analysis Society (EDFAS) Publications Committee. Provides new or expanded coverage on important techniques for microelectronic failure analysis. Contents include: Backside isolation techniques; Flip-chip focused ion beam backside navigation; Circuit validation techniques; Copper metallization deprocessing; Tunnelling atomic force microscopy; Scanning capacitance microscopy; Scanning probe microscopy; Packaging and chip cross-sectioning; Glossary of failure analysis tool acronyms; Updated key word index to ISTFA Proceedings volumes and to the Microelectronic Failure Analysis Desk Reference, 4th Edition. (+VAT on UK orders)