Electrodeposition of copper, Part 3: plating cell design can minimize the effects of primary current distribution.(POSITIVE PLATING): An article from: Printed Circuit Design & Fab
Book Details
Author(s)
Michael Carano
Publisher
UP Media Group, Inc.
ISBN / ASIN
B001K9JTZW
ISBN-13
978B001K9JTZ2
Availability
Available for download now
Marketplace
United States 🇺🇸
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Description
This digital document is an article from Printed Circuit Design & Fab, published by UP Media Group, Inc. on September 1, 2008. The length of the article is 677 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available immediately after purchase. You can view it with any web browser.
Citation Details
Title: Electrodeposition of copper, Part 3: plating cell design can minimize the effects of primary current distribution.(POSITIVE PLATING)
Author: Michael Carano
Publication:Printed Circuit Design & Fab (Magazine/Journal)
Date: September 1, 2008
Publisher: UP Media Group, Inc.
Volume: 25 Issue: 9 Page: 18(1)
Distributed by Gale, a part of Cengage Learning
Citation Details
Title: Electrodeposition of copper, Part 3: plating cell design can minimize the effects of primary current distribution.(POSITIVE PLATING)
Author: Michael Carano
Publication:Printed Circuit Design & Fab (Magazine/Journal)
Date: September 1, 2008
Publisher: UP Media Group, Inc.
Volume: 25 Issue: 9 Page: 18(1)
Distributed by Gale, a part of Cengage Learning
