Electroplating of copper, Part 4: anode-cathode placement and secondary current distribution.(POSITIVE PLATING): An article from: Printed Circuit Design & Fab

This digital document is an article from Printed Circuit Design & Fab, published by UP Media Group, Inc. on November 1, 2008. The length of the article is 628 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available immediately after purchase. You can view it with any web browser.

Citation Details
Title: Electroplating of copper, Part 4: anode-cathode placement and secondary current distribution.(POSITIVE PLATING)
Author: Michael Carano
Publication:Printed Circuit Design & Fab (Magazine/Journal)
Date: November 1, 2008
Publisher: UP Media Group, Inc.
Volume: 25 Issue: 11 Page: 16(1)

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