Electroplating of copper, part 5: organic addition agents influence secondary current distribution and control the physical properties of the copper ... An article from: Printed Circuit Design & Fab
Book Details
Author(s)
Michael Carano
Publisher
UP Media Group, Inc.
ISBN / ASIN
B001QAOXEW
ISBN-13
978B001QAOXE1
Availability
Available for download now
Sales Rank
#11,948,748
Marketplace
United States 🇺🇸
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Description
This digital document is an article from Printed Circuit Design & Fab, published by UP Media Group, Inc. on January 1, 2009. The length of the article is 562 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available immediately after purchase. You can view it with any web browser.
Citation Details
Title: Electroplating of copper, part 5: organic addition agents influence secondary current distribution and control the physical properties of the copper deposit.(POSITIVE PLATING)
Author: Michael Carano
Publication:Printed Circuit Design & Fab (Magazine/Journal)
Date: January 1, 2009
Publisher: UP Media Group, Inc.
Volume: 26 Issue: 1 Page: 18(1)
Distributed by Gale, a part of Cengage Learning
Citation Details
Title: Electroplating of copper, part 5: organic addition agents influence secondary current distribution and control the physical properties of the copper deposit.(POSITIVE PLATING)
Author: Michael Carano
Publication:Printed Circuit Design & Fab (Magazine/Journal)
Date: January 1, 2009
Publisher: UP Media Group, Inc.
Volume: 26 Issue: 1 Page: 18(1)
Distributed by Gale, a part of Cengage Learning
